When electroplating, copper is separated both on the PCB surface and in the via holes which serve for through-plating.
This process is computer-controlled and based on electrolysis. The PCBs run through various baths in which copper is transferred from the anode to the cathode, in this case the PCB, via current flow.
The required final copper is applied during electroplating. Depending on how high the copper is to be structured, the throughput time is accordingly longer. The conductive pattern is decisive for even copper distribution on the surface. Therefore, it is possible that an additional copper grid must be applied..
At Unimicron, the processes for applying the final surfaces are also integrated in the electroplating department in-part. Chemical tin, chemical nickel/gold, HASL (Hot Air Solder Levelling) and as external process chemical nickel/palladium/gold, hard gold and OSP are offered.