Heat Management

Heat Management

High temperatures act on printed circuit boards not only when they are exposed to high ambient temperature, for example on an engine block, in the exhaust gas train, or in the brake system of a vehicle.

The increasing compaction of performance in electronics leads to rising temperatures developing on the circuit board. This as a result of heat loss from high-performance components or inherent warming of conductors due to the transmission of high currents. In line with maximum assembly reliability, the heat generated must be dissipated in such a way that critical temperatures are not reached or exceeded. This is where modern heat management solutions that distribute high temperatures uniformly across an area and dissipate them at the surface or at the housing can help to keep heat away from sensitive components. Unimicron Germany offers a large number of solution concepts for this.

 

Download the brochure with a detailed description of our Heat Management technology here.